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Vacuum suction stage, suction plate, suction chuck (standard 60 types)

For correcting and fixing the warping of films, wafers, and thin plates. Choose from 3 methods × 60 standard types.

Vacuum suction stages and suction plates that can be selected from three methods: through-hole, V-groove, and porous ceramic, with 60 standard types available. Designed for correcting warpage and securing thin plates such as films, wafers, and glass substrates, as well as for fixing workpieces during inspection and assembly. Heat resistance is standard at 200°C and can be customized up to 500°C, suitable for wafer chucks, film chucks, and equipment integration. Custom manufacturing of sizes and shapes is available from one unit.

  • Other semiconductor manufacturing equipment
  • Visual Inspection Equipment
  • Other machine elements
  • Suction plate suction chuck

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